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AI’s New Memory Frontier: SK Hynix Unleashes 12-Layer HBM3e for Q3 Powering the Next Wave of AI: SK Hynix’s HBM3e Breakthrough The insatiable demand for artificial intelligence is reshaping the technological landscape at an unprecedented pace, driving innovations across hardware and software alike. At the heart of this revolution lies memory, specifically High Bandwidth Memory (HBM), which has become the critical determinant for the performance of advanced AI accelerators. In this intensely competitive arena, SK Hynix’s 12-layer HBM3e mass production for Q3 2024 AI server demand emerges as a pivotal development, poised to redefine the capabilities of AI infrastructure. This advanced memory solution, characterized by its significantly increased capacity and unparalleled bandwidth, is not just an incremental upgrade; it represents a foundational shift necessary to fuel the next generation of large language models (LLMs) and complex AI workloads. This ...